Mechanical Testing

  • Microsections

    • Unparalleled expertise and throughput
    • Printed boards, solder joints, components and related features of electronic assemblies
    • Next business afternoon turns for structural integrity (Group A) testing
    • Evaluation and imaging with top of the line microscopes/optics and cameras
  • Thermal Cycling/Shock

    • Liquid-to-liquid thermal shock, and
    • Single chamber air cycling
  • Convection Reflow Simulation

    • Feedback controlled, batch oven, forced air convection reflow simulation.
    • This allows us to guarantee conformance with IPC-TM-650 method 2.6.27, J-STD-020, or your custom profile every time with no profiling overhead.

Many other mechanical services are available.